Located on the edge of the Frankfurt-Rhine-Main metropolitan region, TH Aschaffenburg (= Aschaffenburg University of Applied Sciences) is characterised by its business-oriented, predominantly interdisciplinary and innovative degree programs. Close cooperation with companies and application-oriented research ensure that more than 3,300 students have an optimal practical orientation.
Wertheim/Aschaffenburg, 16.04.2021
Located on the edge of the Frankfurt-Rhine-Main metropolitan region, TH Aschaffenburg (= Aschaffenburg University of Applied Sciences) is characterised by its business-oriented, predominantly interdisciplinary and innovative degree programs. Close cooperation with companies and application-oriented research ensure that more than 3,300 students have an optimal practical orientation. In the Microcomputer Technology Laboratory, which is part of the Faculty of Engineering, students now have access to the Ersa HR 500, a professional and flexible rework system.
Prof. Dr.-Ing. Francesco P. Volpe is a professor in the Electrical Engineering and Information Technology degree program and is in charge of the practice-oriented elective “Printed Circuit Board Unbundling with EAGLE”, which takes place in the Microcomputer Technology Laboratory. The aim for the students participating in this course is to produce a USB sound stick in which SMD components and digital/analogue converter ICs are to be processed in the TQFP package.
The students will learn all of the process steps – starting with the handling of the program EAGLE from Autodesk, the correct layout of simple circuits, the application of existing design rules for high-frequency circuits right through to the equipping and soldering of the USB sound card.
The Thin Quad Flat Packages (TQFN) used in this process are very flat, usually square surface-mounted plastic housings. They usually have 32 to 200 pins arranged in a grid with dimensions ranging from 0.4 to 1 mm.
Alignment of a TQFP component using the HR 500
The Visionbox of the HR 500 provides high-resolution camera images 
From layout to soldering: students produce USB sound sticks
Installation of the HR 500 at the Microcomputer Technology Laboratory of TH Aschaffenburg
Homogeneous component heating through the hybrid top heater and infrared heating elements in the bottom heaterShare this article:
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