The increasing trend towards miniaturisation throughout the electronic segment has a major influence on the sensor systems used. Sensors should be as small as possible, yet at the same time extremely powerful and sturdy. With these requirements in mind, a series of tasks that demand a high level of both flexibility and precision have to be performed. In order to achieve best possible qualitative production and development results, the radar technology company InnoSenT counts on its high-quality advanced machinery and recently invested in an Ersa HR 550 rework system.
Wertheim/Donnersdorf
The increasing trend towards miniaturisation throughout the electronic segment has a major influence on the sensor systems used. Sensors should be as small as possible, yet at the same time extremely powerful and sturdy. With these requirements in mind, a series of tasks that demand a high level of both flexibility and precision have to be performed. In order to achieve best possible qualitative production and development results, the radar technology company InnoSenT counts on its high-quality advanced machinery and recently invested in an Ersa HR 550 rework system.
Founded in 1999, InnoSenT GmbH is now one of the leading companies in the world in the radar technology segment. At its company headquarters in Donnersdorf, Lower Franconia, the manufacturer and developer of innovative sensor solutions offers the entire scope of engineering services and electronics production: from customer-specific development through prototype manufacturing and series production of its own products, to contract manufacturing (EMS). Thanks to the strong focus on quality and innovation, InnoSenT is considered a technology driver for industrial and automotive sensors and has been on the road to success for years.
In order to meet the requirements of increasingly difficult assemblies, InnoSenT was looking for a system that could reliably equip and solder very small assemblies and could also be used to carry out rework if necessary. Specifically, this involved the processing of special radar high-frequency chips with unusually small dimensions of less than 1mm². For this, the system must correctly pick up the chip with its 150µ diameter connections, align and solder them in a safe and controlled process. The HR 550’s high-precision component placement with force detection as well as the computer-assisted component placement can reliably meet this challenge.
Used in InnoSenT prototype construction: the Ersa HR 550
Self-explanatory pictograms make it easier for users to handle the system
Highly precise component pick-up and placement
With the HR 550, the processing of component sizes from 01005 to 70 x 70 mm is possiblePowerful and flexible reworking
Collaboration a success
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