Ersa has been engaged in the repair of electronic assemblies for 25 years. The focus here is particularly on the rework of highly polarized SMT components. In times of component shortages and interrupted supply chains, it is more important than ever to maintain the value already achieved…

Published in: Productronic 05/2022
Author: Jörg Nolte
Ersa has been engaged in the repair of electronic assemblies for 25 years. The focus here is particularly on the rework of highly polarized SMT components. In times of component shortages and interrupted supply chains, it is more important than ever to maintain the value already achieved, also in terms of sustainable management. Reviews and insights into this exciting technology are provided by Ersa Product Manager Jörg Nolte.
It all started in 1997 with the IR 500 A, the first infrared rework system from Ersa. It was developed together with the small Odenwald company Rewatronik in order to be able to safely desolder and solder the “Ball Grid Array” components (BGA), which were still new at that time. Very quickly, in a further cooperation with the Swiss placement specialist Essemtec, a suitable unit for component placement was designed, because fine-pitch components and those with hidden solder joints could not be placed precisely enough by hand. “When I joined Ersa in 2000, SMT/BGA repair was still in its early days,” reports Jörg Nolte, who is Ersa’s product manager for rework. He adds, “But then things progressed steadily, because they had backed the right horse – the spread of ball grid arrays in particular, which were initially difficult to master, increased steadily and with it the need for qualified rework.”
Today, the BGA belongs to the family of bottom terminated components (BTC), i.e. components with solder joints on the bottom side of the component. In the early years, the BGAs were often the most sensitive components of an assembly: If the thermal balance in the soldering process was not completely level, the package was deformed and bridging or other soldering defects often occurred as a result. And thus to more frequent failures and the need for repairs. The classical problem with the BGAs is and was too much stress in the solder joints of the corner balls and the associated microcracks. The re-melting of the BGA with the addition of a little flux remains a proven method of repairing such defects to this day. Even today, the followers of the BGA are sensitive to the relevant process parameters. “Micro Lead Frame” (MLF) components tend to float when the amount of solder used is inaccurate, resulting in open signal contacts. The list of error patterns and causes can be continued – the important thing is that safe repair processes have been established for all these cases.
IR-Technology
Even today, you can find adventurous clips on the internet of people trying to swap processors and other components on circuit boards with the help of hot air guns. The soldering results: more than questionable. Ersa had to invest a lot of time and energy in convincing users of the infrared technology of its systems, from cell phone service centers to the electronics industry. Established manufacturers of hot gas rework systems also did everything they could at the time to torpedo IR technology. “It was claimed that components would get too hot, the process could not be controlled and reflective surfaces would not get hot, the user would be harmed by the IR radiation,” recalls Nolte of the verbal barriers of the early years.
The medium-wave and thus largely invisible radiant heat of the ceramic heaters, however, was convincing: Unlike quartz emitters, their radiation spectrum is perfectly suited to heat metals, plastics, ceramics and epoxy resins of a fixed assembly quickly and homogeneously. The temperature differences measured over a component (delta T) reached values of only 6 °C and below. It quickly became clear to many users that the sensor-guided process of a medium-wave IR rework system even has advantages over established techniques – the solder profile follows the specification very precisely due to precise temperature control. The components and assemblies are heated homogeneously and gently. Because no component-specific nozzles are required, there is an open view of the solder joints and the process can be observed by means of cameras.